Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5220199 | Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate | Nobuo Owada, Tohru Kobayashi, Mikinori Kawaji | 1993-06-15 |
| 5027188 | Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate | Nobuo Owada, Tohru Kobayashi, Mikinori Kawaji | 1991-06-25 |