Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
GM

Gen Murakami

Hitachi: 66 patents #126 of 28,497Top 1%
HCHitachi Cable: 11 patents #38 of 1,086Top 4%
TITexas Instruments: 4 patents #3,281 of 12,488Top 30%
RTRenesas Technology: 4 patents #758 of 3,337Top 25%
HSHitachi Microcomputer System: 3 patents #41 of 257Top 20%
HEHitachi Vlsi Engineering: 3 patents #237 of 666Top 40%
SCStanley Electric Co.: 2 patents #339 of 1,072Top 35%
HSHitachi Tohbu Semiconductor: 1 patents #126 of 223Top 60%
DCDia Nippon Printing Co.: 1 patents #1 of 18Top 6%
Overall (All Time): #22,298 of 4,157,543Top 1%
81 Patents All Time

Issued Patents All Time

Showing 26–50 of 81 patents

Patent #TitleCo-InventorsDate
6031292 Semiconductor device, interposer for semiconductor device Mamoru Mita, Toyohiko Kumakura, Norio Okabe, Katsuji Komatsu, Shoji Shinzawa 2000-02-29
6030859 Method of making a packaged semiconductor device and a lead-frame therefor Ichiro Anjoh, Michael A. Lamson, Katherine G. Heinen 2000-02-29
6018191 Semiconductor device Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more 2000-01-25
6002167 Semiconductor device having lead on chip structure Kazuhisa Hatano, Tatsuya Ohtaka, Takaharu Yonemoto, Osamu Yoshioka 1999-12-14
5988368 Resist pattern forming method using anti-reflective layer resist pattern formed and method of etching using resist pattern and product formed Wahei Kitamura, Kunihiko Nishi 1999-11-23
5981315 Semiconductor device Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more 1999-11-09
5914530 Semiconductor device Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more 1999-06-22
5869888 Semiconductor device with lead structure on principal surface of chip Kunihiro Tsubosaki, Michio Tanimoto, Kunihiko Nishi, Masahiro Ichitani, Shunji Koike +7 more 1999-02-09
5866948 Interposer for semiconductor device Mamoru Mita, Toyohiko Kumakura, Norio Okabe, Katsuji Komatsu, Shoji Shinzawa 1999-02-02
5863817 Semiconductor device Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more 1999-01-26
5821606 Semiconductor device Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more 1998-10-13
5803246 Surface package type semiconductor package and method of producing semiconductor memory Wahei Kitamura, Kunihiko Nishi 1998-09-08
5793099 Semiconductor device Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more 1998-08-11
5742101 Semiconductor device Toshiyuki Sakuta, Kazuyuki Miyazawa, Satoshi Oguchi, Aizo Kaneda, Masao Mitani +2 more 1998-04-21
5714405 Semiconductor device Kunihiro Tsubosaki, Michio Tanimoto, Kunihiko Nishi, Masahiro Ichitani, Shunji Koike +7 more 1998-02-03
5701031 Sealed stacked arrangement of semiconductor devices Satoshi Oguchi, Masamichi Ishihara, Kazuya Ito, Ichiro Anjoh, Toshiyuki Sakuta +7 more 1997-12-23
5648299 Packaged semiconductor device and a leadframe therefor Ichiro Anjoh, Michael A. Lamson, Katherine G. Heinen 1997-07-15
5612569 Semiconductor device Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more 1997-03-18
5607059 Surface package type semiconductor package and method of producing semiconductor memory Wahei Kitamura, Kunihiko Nishi 1997-03-04
5585665 Packaged semiconductor device and a leadframe therefor Ichiro Anjoh, Michael A. Lamson, Katherine G. Heinen 1996-12-17
5583375 Semiconductor device with lead structure within the planar area of the device Kunihiro Tsubosaki, Michio Tanimoto, Kunihiko Nishi, Masahiro Ichitani, Shunji Koike +7 more 1996-12-10
5530286 Semiconductor device Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more 1996-06-25
5514905 Semiconductor device Toshiyuki Sakuta, Kazuyuki Miyazawa, Satoshi Oguchi, Aizo Kaneda, Masao Mitani +2 more 1996-05-07
5448105 Semiconductor device having a leadframe and metal substrate Kazunori Katoh, Hiromichi Suzuki, Takayuki Okinaga, Takashi Emata, Osamu Horiuchi 1995-09-05
5442233 Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation Ichiro Anjoh, Michael A. Lamson, Katherine G. Heinen 1995-08-15