Issued Patents All Time
Showing 51–75 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5365113 | Semiconductor device | Toshiyuki Sakuta, Kazuyuki Miyazawa, Satoshi Oguchi, Aizo Kaneda, Masao Mitani +2 more | 1994-11-15 |
| 5358904 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more | 1994-10-25 |
| 5357139 | Plastic encapsulated semiconductor device and lead frame | Akihiro Yaguchi, Asao Nishimura, Makoto Kitano, Ryuji Kohno, Nae Yoneda +1 more | 1994-10-18 |
| 5332922 | Multi-chip semiconductor package | Satoshi Oguchi, Masamichi Ishihara, Kazuya Ito, Ichiro Anjoh, Toshiyuki Sakuta +7 more | 1994-07-26 |
| 5304844 | Semiconductor device and method of producing the same | Osamu Horiuchi, Hiromichi Suzuki, Hajime Hasebe, Kanji Otsuka, Yuuji Shirai +2 more | 1994-04-19 |
| 5296737 | Semiconductor device with a plurality of face to face chips | Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno +1 more | 1994-03-22 |
| 5295297 | Method of producing semiconductor memory | Wahei Kitamura, Kunihiko Nishi | 1994-03-22 |
| 5274914 | Method of producing surface package type semiconductor package | Wahei Kitamura, Kunihiko Nishi | 1994-01-04 |
| 5256903 | Plastic encapsulated semiconductor device | Maya Obata, Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Ryuji Kohno +2 more | 1993-10-26 |
| 5235207 | Semiconductor device | Eiji Ohi, Hiromichi Suzuki | 1993-08-10 |
| 5194935 | Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure | Makoto Kitano, Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno +2 more | 1993-03-16 |
| 5184208 | Semiconductor device | Toshiyuki Sakuta, Kazuyuki Miyazawa, Satoshi Oguchi, Aizo Kaneda, Masao Mitani +2 more | 1993-02-02 |
| 5150193 | Resin-encapsulated semiconductor device having a particular mounting structure | Toshihiro Yasuhara, Masachika Masuda, Kunihiko Nishi, Masanori Sakimoto, Ichio Shimizu +3 more | 1992-09-22 |
| 5095626 | Method of producing semiconductor memory packages | Wahei Kitamura, Kunihiko Nishi | 1992-03-17 |
| 5068712 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 1991-11-26 |
| 5032895 | Semiconductor device and method of producing the same | Osamu Horiuchi, Hiromichi Suzuki, Hajime Hasebe, Kanji Otsuka, Yuuji Shirai +2 more | 1991-07-16 |
| 4994411 | Process of producing semiconductor device | Takahiro Naito, Hiromichi Suzuki, Hajime Sato, Wahei Kitamura, Masachika Masuda | 1991-02-19 |
| 4989068 | Semiconductor device and method of manufacturing the same | Toshihiro Yasuhara, Masachika Masuda | 1991-01-29 |
| 4987474 | Semiconductor device and method of manufacturing the same | Toshihiro Yasuhara, Masachika Masuda, Asao Nishimura, Naozumi Hatada, Sueo Kawai +3 more | 1991-01-22 |
| 4971196 | Surface package type semiconductor package | Wahei Kitamura, Kunihiko Nishi | 1990-11-20 |
| 4951122 | Resin-encapsulated semiconductor device | Kunihiro Tsubosaki, Toshiyuki Sakuta, Masamichi Ishihara, Satoru Ito, Yasuo Mori | 1990-08-21 |
| 4707724 | Semiconductor device and method of manufacturing thereof | Akira Suzuki, Hideki Tanaka | 1987-11-17 |
| 4706105 | Semiconductor device and method of producing the same | Masachika Masuda | 1987-11-10 |
| 4691225 | Semiconductor device and a method of producing the same | Takeshi Gappa | 1987-09-01 |
| 4301464 | Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member | Keizo Otsuki, Hidetoshi Mochizuki, Akira Suzuki, Yoshio Adachi, Hideki Kosaka | 1981-11-17 |