Issued Patents All Time
Showing 1–25 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7476913 | Light emitting device having a mirror portion | Hiroyuki Isobe, Toshikatsu Hiroe | 2009-01-13 |
| 7317181 | Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit | Tetsuya Saito, Atsushi Otaka, Toshiaki Morikawa, Tomoaki Abe, Dai Aoki | 2008-01-08 |
| 6995510 | Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit | Tetsuya Saito, Atsushi Otaka, Toshiaki Morikawa, Tomoaki Abe, Dai Aoki | 2006-02-07 |
| 6981585 | Surface package type semiconductor package and method of producing semiconductor memory | Wahei Kitamura, Kunihiko Nishi | 2006-01-03 |
| 6919622 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2005-07-19 |
| 6855893 | Wiring board, semiconductor device, electronic device, and circuit board for electronic parts | Toyohiko Kumakura, Tomo Yasuda, Masahiko Kobayashi, Hidetoshi Murakami | 2005-02-15 |
| 6720208 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2004-04-13 |
| 6531760 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2003-03-11 |
| 6443298 | Surface package type semiconductor package and method of producing semiconductor memory | Wahei Kitamura, Kunihiko Nishi | 2002-09-03 |
| 6433409 | Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same | Mamoru Mita | 2002-08-13 |
| 6426548 | Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same | Mamoru Mita | 2002-07-30 |
| RE37539 | Sealed stacked arrangement of semiconductor devices | Satoshi Oguchi, Masamichi Ishihara, Kazuya Ito, Ichiro Anjoh, Toshiyuki Sakuta +7 more | 2002-02-05 |
| 6326681 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2001-12-04 |
| 6303982 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2001-10-16 |
| 6297142 | Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloy | Mamoru Mita | 2001-10-02 |
| 6223893 | Surface package type semiconductor package and method of producing semiconductor memory | Wahei Kitamura, Kunihiko Nishi | 2001-05-01 |
| 6204552 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2001-03-20 |
| 6130114 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more | 2000-10-10 |
| 6124629 | Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2000-09-26 |
| 6114751 | Semiconductor device and electronic device | Toyohiko Kumakura, Tomo Yasuda | 2000-09-05 |
| 6100580 | Semiconductor device having all outer leads extending from one side of a resin member | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2000-08-08 |
| 6100115 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2000-08-08 |
| 6081023 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more | 2000-06-27 |
| 6072231 | Semiconductor device | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh, Asao Nishimura +19 more | 2000-06-06 |
| 6069029 | Semiconductor device chip on lead and lead on chip manufacturing | Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo, Asao Nishimura +19 more | 2000-05-30 |