Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7185421 | Method and apparatus for manufacturing multilayer printed wiring board | Tadahiro Ohmi | 2007-03-06 |
| 6855893 | Wiring board, semiconductor device, electronic device, and circuit board for electronic parts | Toyohiko Kumakura, Gen Murakami, Tomo Yasuda, Masahiko Kobayashi | 2005-02-15 |