YA

Yoshio Adachi

SC Seiko Kagaku Kogyo Co.: 3 patents #4 of 11Top 40%
HM Hokuetsu Paper Mills: 2 patents #5 of 20Top 25%
NO Nippon Oil: 2 patents #264 of 773Top 35%
Sumitomo Electric Industries: 2 patents #9,741 of 21,551Top 50%
TS Tetra Laval Holdings & Finance S.A.: 1 patents #662 of 1,364Top 50%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
📍 Tosu, JP: #8 of 191 inventorsTop 5%
Overall (All Time): #350,833 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
9321649 Carbon microparticle having lignin as raw material and preparation method therefor Katsumi Kamegawa, Tsuyoshi Sakaki, Kinya Sakanishi, Masaya Kodama, Keiko Nishikubo 2016-04-26
9198456 Apparatus and method for heating and sterilizing liquid food 2015-12-01
9025795 Opening type bone conduction earphone 2015-05-05
8986838 Hollow carbon microparticle and method for producing same Katsumi Kamegawa, Tsuyoshi Sakaki, Kinya Sakanishi, Masaya Kodama, Keiko Nishikubo 2015-03-24
7333147 Image pickup device with a three-dimensional circuit board and device assembly method Sadashi Sasaki, Tamotsu Kaneko, Fumikazu Harazono, Tatsuo Kobayashi 2008-02-19
6800943 Solid image pickup device 2004-10-05
5922489 Battery holder 1999-07-13
5761804 Electronic circuit and a method for fabricating the electronic circuit 1998-06-09
5502631 Circuit elements that are ultrasonically welded together 1996-03-26
5134249 Electronic circuit connectors and method of manufacturing the same 1992-07-28
4810301 Composition for sizing agent and process for using the same composition Shigehiko Yoshioka, Tsuneo Yoshida, Hisatake Sato, Hideto Yamada 1989-03-07
4717452 Composition for sizing agent and process for using the same composition Shigehiko Yoshioka, Tsuneo Yoshida, Hisatake Sato, Hideto Yamada 1988-01-05
4533434 Process for sizing paper and process for making plasterboard base paper sized thereby Shigehiko Yoshioka, Hideto Yamada, Kimihiko Goto, Kazuo Miyahana 1985-08-06
4301464 Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member Keizo Otsuki, Hidetoshi Mochizuki, Akira Suzuki, Hideki Kosaka, Gen Murakami 1981-11-17