Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7208539 | Thermosetting resin composition, and prepreg and laminated board using the same | Shinji Tsuchikawa, Michitoshi Arata, Kenichi Tomioka | 2007-04-24 |
| 7147450 | Injection apparatus | Toshihiro Kasai, Junsuke Kawai | 2006-12-12 |
| 7114949 | Method and apparatus for mold clamping in an injection molding machine and the like | Makoto Nishizawa, Toshihiro Kasai, Yukio Iimura | 2006-10-03 |
| 7078106 | Thermosetting resin composition and use thereof | Shinji Tsuchikawa, Yasuyuki Mizuno, Daisuke Fujimoto, Nozomu Takano | 2006-07-18 |
| 7011511 | Injection apparatus for an industrial machine | Makoto Nishizawa, Junsuke Kawai | 2006-03-14 |
| 6932924 | Method and apparatus for mold clamping in an injection molding machine and the like | Makoto Nishizawa, Toshihiro Kasai, Yukio Iimura | 2005-08-23 |
| 6876014 | Interconnection structure of a semiconductor device | Yuzo Fukuzaki | 2005-04-05 |
| 6802703 | Injection unit of electric injection molding machine | Toshihiro Kasai, Junsuke Kawai, Makoto Nishizawa | 2004-10-12 |
| 6783353 | Injection unit of injection molding machine | Toshihiro Kasai, Junsuke Kawai, Fumiyuki Katoh | 2004-08-31 |
| 6667107 | Thermosetting resin composition and use thereof | Shinji Tsuchikawa, Yasuyuki Mizuno, Daisuke Fujimoto, Nozomu Takano | 2003-12-23 |
| 6616871 | Filling step control method of injection molding machine | Yukio Iimura, Makoto Nishizawa, Haruyuki Matsubayashi, Nobuyuki Asanuma, Yutaka Yamaguchi +2 more | 2003-09-09 |
| 6558797 | Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same | Michitoshi Arata, Nozomu Takano | 2003-05-06 |
| 6414072 | Flame-retardant thermoplastic resin composition and products of injection molding thereof | Haruji Murakami, Mineo Ohtake | 2002-07-02 |
| 6326435 | Polyester resin composition | Katsunori Takayama | 2001-12-04 |
| 6197149 | Production of insulating varnishes and multilayer printed circuit boards using these varnishes | Yasushi Kumashiro, Atsushi Takahashi, Koji Morita, Takahiro Tanabe, Kazunori Yamamoto +6 more | 2001-03-06 |
| 6127466 | Injection-molded article | Haruji Murakami, Takayuki Ishikawa | 2000-10-03 |
| 6063848 | Liquid crystalline polymer composition and moldings | Haruji Murakami | 2000-05-16 |
| 6010760 | Thermoplastic resin composition, injection molding method thereof, and injection molded article | Hirotaka Miyazaki, Tomoyuki Aketa, Haruji Murakami, Takayuki Ishikawa, Ayako Migita | 2000-01-04 |
| 5965245 | Prepreg for printed circuit board | Norio Okano, Akishi Nakaso | 1999-10-12 |
| 5879568 | Process for producing multilayer printed circuit board for wire bonding | Naoyuki Urasaki, Kouichi Tsuyama, Norio Okano, Hiroshi Shimizu, Nobuyuki Ogawa +6 more | 1999-03-09 |
| 5391687 | Method of producing high molecular weight epoxy resin using an amide solvent | Katsuji Shibata, Nozomu Takano, Masami Arai, Ikuo Hoshi | 1995-02-21 |
| 5304399 | Method of producing epoxy resin film | Katsuji Shibata, Nozomu Takano, Masami Arai, Ikuo Hoshi | 1994-04-19 |
| 5225268 | Epoxy resin film and method of producing epoxy resin film | Katsuji Shibata, Nozomu Takano, Masami Arai, Ikuo Hoshi | 1993-07-06 |
| 5204396 | Long fiber-reinforced polyamide resin composition and molded articles therefrom | Haruji Murakami, Masaru Miura, Mitsuru Yokouchi | 1993-04-20 |
| 5175610 | Resin molded type semiconductor device having a metallic plate support | — | 1992-12-29 |