Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9054052 | Methods for integration of pore stuffing material | Nicholas V. LiCausi, Errol Todd Ryan, Ming He, Moosung Chae, Kunaljeet Tanwar +4 more | 2015-06-09 |
| 8932934 | Methods of self-forming barrier integration with pore stuffed ULK material | Moosung Chae, Errol Todd Ryan, Nicholas V. LiCausi, Christian Witt, Ailian Zhao +3 more | 2015-01-13 |
| 8907483 | Semiconductor device having a self-forming barrier layer at via bottom | Larry Zhao, Ming He, Xunyuan Zhang | 2014-12-09 |
| 8859419 | Methods of forming copper-based nitride liner/passivation layers for conductive copper structures and the resulting device | Xunyuan Zhang, Larry Zhao, Ming He, John A. Iacoponi, Errol Todd Ryan | 2014-10-14 |
| 8778789 | Methods for fabricating integrated circuits having low resistance metal gate structures | Paul R. Besser, Valli Arunachalam | 2014-07-15 |
| 8753975 | Methods of forming conductive copper-based structures using a copper-based nitride seed layer without a barrier layer and the resulting device | Xunyuan Zhang, Larry Zhao, Ming He, John A. Iacoponi, Errol Todd Ryan | 2014-06-17 |
| 8691689 | Methods for fabricating integrated circuits having low resistance device contacts | Paul R. Besser, Valli Arunachalam | 2014-04-08 |
| 8673766 | Methods of forming copper-based conductive structures by forming a copper-based seed layer having an as-deposited thickness profile and thereafter performing an etching process and electroless copper deposition | Ming He, Xunyuan Zhang, Larry Zhao | 2014-03-18 |
| 8517769 | Methods of forming copper-based conductive structures on an integrated circuit device | Ming He, Xunyuan Zhang, Larry Zhao | 2013-08-27 |