Issued Patents All Time
Showing 151–175 of 181 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8174270 | Systems and methods for assessing standoff capabilities of in-service power line insulators | Roderick A. Hyde, Muriel Y. Ishikawa, Jordin T. Kare, Lowell L. Wood, JR., Victoria Y.H. Wood | 2012-05-08 |
| 8035258 | Systems and methods for assessing standoff capabilities of in-service power line insulators | Roderick A. Hyde, Muriel Y. Ishikawa, Jordin T. Kare, Lowell L. Wood, JR., Victoria Y.H. Wood | 2011-10-11 |
| 7858445 | Wire bonded wafer level cavity package | Kenneth Honer, Giles Humpston, Michael J. Nystrom | 2010-12-28 |
| 7816251 | Formation of circuitry with modification of feature height | Belgacem Haba, Masud Beroz, Young Gon Kim | 2010-10-19 |
| 7793414 | Methods for forming connection structures for microelectronic devices | Belgacem Haba, Masud Beroz, Giles Humpston, Richard Dewitt Crisp | 2010-09-14 |
| 7709968 | Micro pin grid array with pin motion isolation | Philip Damberg, Belgacem Haba, Teck-Gyu Kang | 2010-05-04 |
| 7632708 | Microelectronic component with photo-imageable substrate | Belgacem Haba | 2009-12-15 |
| 7593636 | Pin referenced image sensor to reduce tilt in a camera module | Michael J. Nystrom, Belgacem Haba, Giles Humpston, Jesse Thompson | 2009-09-22 |
| 7566853 | Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture | Kenneth Honer, Bruce M. McWilliams, Nicholas Colella, Charles Liam Goudge | 2009-07-28 |
| 7485956 | Microelectronic package optionally having differing cover and device thermal expansivities | Giles Humpston | 2009-02-03 |
| 7462936 | Formation of circuitry with modification of feature height | Belgacem Haba, Masud Beroz, Young Gon Kim | 2008-12-09 |
| 7449779 | Wire bonded wafer level cavity package | Kenneth Honer, Giles Humpston, Michael J. Nystrom | 2008-11-11 |
| 7351641 | Structure and method of forming capped chips | Belgacem Haba, Masud Beroz, Glenn Urbish | 2008-04-01 |
| 7298030 | Structure and method of making sealed capped chips | Bruce M. McWilliams, Giles Humpston, Belgacem Haba | 2007-11-20 |
| 7262368 | Connection structures for microelectronic devices and methods for forming such structures | Belgacem Haba, Masud Beroz, Giles Humpston, Richard Dewitt Crisp | 2007-08-28 |
| 7224056 | Back-face and edge interconnects for lidded package | Robert Burtzlaff, Belgacem Haba, Giles Humpston, Michael Warner, Craig Mitchell | 2007-05-29 |
| 5804004 | Stacked devices for multichip modules | Nicholas Brathwaite, Paul Frank Marella, Kirk Flatow | 1998-09-08 |
| 5541524 | Burn-in technologies for unpackaged integrated circuits | Pradip D. Patel | 1996-07-30 |
| 5397997 | Burn-in technologies for unpackaged integrated circuits | Pradip D. Patel | 1995-03-14 |
| 5274270 | Multichip module having SiO.sub.2 insulating layer | — | 1993-12-28 |
| 5214844 | Method of assembling integrated circuits to a silicon board | Bruce M. McWilliams, Nicholas Brathwaite | 1993-06-01 |
| 5134539 | Multichip module having integral decoupling capacitor | Pandharinath A. Mhaskar | 1992-07-28 |
| 5046656 | Vacuum die attach for integrated circuits | Edward H. Schmitt | 1991-09-10 |
| 5017509 | Stand-off transmission lines and method for making same | — | 1991-05-21 |
| 4992847 | Thin-film chip-to-substrate interconnect and methods for making same | — | 1991-02-12 |