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Electroplating method |
Shingo Yasuda, Fumio Kuriyama, Masashi Shimoyama, Yusuke Tamari |
2016-06-28 |
| 8784636 |
Plating apparatus and plating method |
Nobutoshi Saito, Fumio Kuriyama, Akira Fukunaga |
2014-07-22 |
| 7736474 |
Plating apparatus and plating method |
Keiichi Kurashina, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima, Shinya Morisawa +7 more |
2010-06-15 |
| 7553400 |
Plating apparatus and plating method |
Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Ryoichi Kimizuka, Hariklia Deligianni +4 more |
2009-06-30 |
| 7479213 |
Plating method and plating apparatus |
Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Hidenao Suzuki, Koji Mishima +3 more |
2009-01-20 |
| 7311809 |
Plating apparatus for substrate |
Keiichi Kurashina, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima, Brett Baker +2 more |
2007-12-25 |
| 7033463 |
Substrate plating method and apparatus |
Akihisa Hongo, Naoaki Ogure, Hiroaki Inoue, Satoshi Sendai, Tetsuma Ikegami +4 more |
2006-04-25 |
| 6908534 |
Substrate plating method and apparatus |
Akihisa Hongo, Kanji Ohno, Ryoichi Kimizuka, Megumi Maruyama |
2005-06-21 |
| 6793794 |
Substrate plating apparatus and method |
Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Kenichi Suzuki +3 more |
2004-09-21 |
| 6709563 |
Copper-plating liquid, plating method and plating apparatus |
Shuichi Okuyama, Ryoichi Kimizuka, Takeshi Kobayashi |
2004-03-23 |
| 6638411 |
Method and apparatus for plating substrate with copper |
Koji Mishima, Ryoichi Kimizuka, Tetsuo Matsuda, Hisashi Kaneko |
2003-10-28 |
| 6517894 |
Method for plating a first layer on a substrate and a second layer on the first layer |
Akihisa Hongo, Kanji Ohno, Ryoichi Kimizuka, Megumi Maruyama |
2003-02-11 |
| 6365017 |
Substrate plating device |
Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Kenichi Suzuki +3 more |
2002-04-02 |
