Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11250559 | Inspection method and system | Zhao-Li Zhang, Jack Jau | 2022-02-15 |
| 11238579 | Defect pattern grouping method and system | Haili Zhang, Zhichao Chen, Shengcheng JIN | 2022-02-01 |
| 11216938 | Systems and methods of optimal metrology guidance | Lingling PU, Nan Zhao, Wentian ZHOU, Teng Wang, Ming Xu | 2022-01-04 |
| 11175248 | Apparatus and method for detecting time-dependent defects in a fast-charging device | Long Ma, Chih-Yu JEN, Zhonghua Dong, Peilei Zhang, Chuan Li | 2021-11-16 |
| 11175590 | Low dose charged particle metrology system | Fei Wang, Kuo-Shih Liu | 2021-11-16 |
| 11126089 | Method for determining corrections to features of a mask | Lingling PU, Zhichao Chen, Haili Zhang, Pengcheng Zhang | 2021-09-21 |
| 11087954 | System and method for bare wafer inspection | Joe Wang | 2021-08-10 |
| 11043356 | Local alignment point calibration method in die inspection | Kevin Liu, Fei Wang, Jack Jau, Zhaohui Guo | 2021-06-22 |
| 10679340 | Inspection method and system | Zhao-Li Zhang, Jack Jau | 2020-06-09 |
| 10497538 | Local alignment point calibration method in die inspection | Kevin Liu, Fei Wang, Jack Jau, Zhaohui Guo | 2019-12-03 |
| 10380731 | Method and system for fast inspecting defects | Jack Jau | 2019-08-13 |
| 10147178 | Method of recognizing wafer | — | 2018-12-04 |
| 10102619 | Inspection method and system | Zhao-Li Zhang, Jack Jau | 2018-10-16 |
| 9965844 | Inspection method and system | Zhao-Li Zhang, Jack Jau | 2018-05-08 |
| 9953803 | Local alignment point calibration method in die inspection | Kevin Liu, Fei Wang, Jack Jau | 2018-04-24 |
| 9541824 | Method and system for fast inspecting defects | Jack Jau | 2017-01-10 |
| 9494856 | Method and system for fast inspecting defects | Jack Jau | 2016-11-15 |
| 9436988 | Method and system of classifying defects on a wafer | Zhaoli Zhang, Jack Jau | 2016-09-06 |
| 9282293 | Method and system for measuring critical dimension and monitoring fabrication uniformity | Jack Jau, Hong Xiao | 2016-03-08 |
| 9251581 | Methods for promoting semiconductor manufacturing yield and classifying defects during fabricating a semiconductor device, and computer readable mediums encoded with a computer program implementing the same | Shih-Tsung Chen, Yu Fu, Futang Peng, Zhao-Li Zhang | 2016-02-02 |
| 9100553 | Method and system for measuring critical dimension and monitoring fabrication uniformity | Jack Jau, Hong Xiao | 2015-08-04 |
| 9041795 | Method and system for measuring critical dimension and monitoring fabrication uniformity | Jack Jau, Hong Xiao | 2015-05-26 |
| 8937281 | Method for examining a sample by using a charged particle beam | Yan Zhao, Jack Jau | 2015-01-20 |
| 8923601 | Method for inspecting overlay shift defect during semiconductor manufacturing and apparatus thereof | Hong Xiao, Jack Jau | 2014-12-30 |
| 8884224 | Charged particle beam imaging assembly and imaging method thereof | Jack Jau, Yan Zhao | 2014-11-11 |