Issued Patents All Time
Showing 51–63 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8805054 | Method and system of classifying defects on a wafer | Zhao-Li Zhang, Jack Jau | 2014-08-12 |
| 8759762 | Method and apparatus for identifying plug-to-plug short from a charged particle microscopic image | Hong Xiao | 2014-06-24 |
| 8712184 | Method and system for filtering noises in an image scanned by charged particles | Chad Liao, Futang Peng, Chuan Li, Alina Wang, Zhao-Li Zhang +1 more | 2014-04-29 |
| 8692193 | Method for inspecting EUV reticle and apparatus thereof | Chiyan Kuan, You-Jin Wang | 2014-04-08 |
| 8606017 | Method for inspecting localized image and system thereof | Jack Jau, Zhao-Li Zhang | 2013-12-10 |
| 8432441 | Method and system for measuring critical dimension and monitoring fabrication uniformity | Hong Xiao, Jack Jau | 2013-04-30 |
| 8299431 | Method for examining a sample by using a charged particle beam | Yan Zhao, Jack Jau | 2012-10-30 |
| 8217349 | Method for inspecting EUV reticle and apparatus thereof | Chiyan Kuan, You-Jin Wang | 2012-07-10 |
| 8094924 | E-beam defect review system | Jack Jau, Zhongwei Chen, Yi Wang, Chung-Shih Pan, Joe Wang +2 more | 2012-01-10 |
| 8068662 | Method and system for determining a defect during charged particle beam inspection of a sample | Zhao-Li Zhang, Jack Jau | 2011-11-29 |
| 8055059 | Method and system for determining a defect during sample inspection involving charged particle beam imaging | Jack Jau | 2011-11-08 |
| 8050490 | Method for inspecting overlay shift defect during semiconductor manufacturing and apparatus thereof | Hong Xiao, Jack Jau | 2011-11-01 |
| 8010307 | In-line overlay measurement using charged particle beam system | Jack Jau, Hong Xiao | 2011-08-30 |