Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9412674 | Shielded wire arrangement for die testing | Myongseob Kim, Henley Liu, Cheang-Whang Chang | 2016-08-09 | $8,970,000 |
| 9337138 | Capacitors within an interposer coupled to supply and ground planes of a substrate | Khaldoon S. Abugharbieh, Gregory Meredith, Christopher P. Wyland, Paul Ying-Fung Wu, Henley Liu +1 more | 2016-05-10 | $10,046,000 |
| 7737439 | Semiconductor component having test pads and method and apparatus for testing same | Mohsen H. Mardi, Jae-Weon Cho, Xin Wu, Chih-Chung Wu, Shih-Liang Liang +1 more | 2010-06-15 | $5,059,000 |
| 7235412 | Semiconductor component having test pads and method and apparatus for testing same | Mohsen H. Mardi, Jae-Weon Cho, Xin Wu, Chih-Chung Wu, Shih-Liang Liang +1 more | 2007-06-26 | $8,288,000 |
| 7199610 | Integrated circuit interconnect structure having reduced coupling between interconnect lines | Steven P. Young, Ramakrishna K. Tanikella | 2007-04-03 | $12,610,000 |