Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027465 | Impedance controlled electrical interconnection employing meta-materials | — | 2024-07-02 |
| 11937368 | Structure for circuit interconnects | — | 2024-03-19 |
| 11653477 | Thermal management with variable conductance heat pipe | Roberto Marcoccia, Brian R. Koch, Theodore J. Schmidt, Robert Silvio Guzzon, Gregory Alan Fish | 2023-05-16 |
| 11456255 | Impedance controlled electrical interconnection employing meta-materials | — | 2022-09-27 |
| 11051431 | Thermal management with variable conductance heat pipe | Roberto Marcoccia, Brian R. Koch, Theodore J. Schmidt, Robert Silvio Guzzon, Gregory Alan Fish | 2021-06-29 |
| 10999923 | Structure for circuit interconnects | — | 2021-05-04 |
| 10483209 | Impedance controlled electrical interconnection employing meta-materials | — | 2019-11-19 |
| 10292307 | Thermal heatsink | — | 2019-05-14 |
| 9377802 | Dynamic configuration of equivalent series resistance | Romi Mayder, Paul Ying-Fung Wu | 2016-06-28 |
| 9337138 | Capacitors within an interposer coupled to supply and ground planes of a substrate | Khaldoon S. Abugharbieh, Gregory Meredith, Paul Ying-Fung Wu, Henley Liu, Sanjiv Stokes +1 more | 2016-05-10 |
| 9006098 | Impedance controlled electrical interconnection employing meta-materials | — | 2015-04-14 |
| 8680677 | Carbon nanotube-based conductive connections for integrated circuit devices | — | 2014-03-25 |
| 8451072 | Method for transmission lines using meta-materials | — | 2013-05-28 |
| 8410579 | Power distribution network | Atul V. Ghia, Ketan Sodha, Paul T. Sasaki, Jian Tan, Paul Ying-Fung Wu +1 more | 2013-04-02 |
| 8143976 | High impedance electrical connection via | — | 2012-03-27 |
| RE36907 | Leadframe with power and ground planes | Thomas H. Templeton, Jr., David Landis Campbell | 2000-10-10 |
| 6111199 | Integrated circuit package using a gas to insulate electrical conductors | Richard L. Guilhamet | 2000-08-29 |
| 6084770 | Device and method for convective cooling of an electronic component | — | 2000-07-04 |
| 6039471 | Device for simulating dissipation of thermal power by a board supporting an electronic component | — | 2000-03-21 |
| 5997174 | Method for determining a thermal parameter of a device by measuring thermal resistance of a substrate carrying the device | — | 1999-12-07 |
| 5986885 | Semiconductor package with internal heatsink and assembly method | — | 1999-11-16 |
| 5962924 | Semi-conductor die interconnect | Atlantico S. Medina | 1999-10-05 |
| 5931580 | Apparatus for measuring junction temperature | — | 1999-08-03 |
| 5897335 | Flip-chip bonding method | Atlantico S. Medina | 1999-04-27 |
| 5870517 | Package including self-aligned laser diode and method of aligning a laser diode | — | 1999-02-09 |