Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5962924 | Semi-conductor die interconnect | Christopher P. Wyland | 1999-10-05 |
| 5897335 | Flip-chip bonding method | Christopher P. Wyland | 1999-04-27 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5962924 | Semi-conductor die interconnect | Christopher P. Wyland | 1999-10-05 |
| 5897335 | Flip-chip bonding method | Christopher P. Wyland | 1999-04-27 |