Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7456110 | Method and apparatus for controlling etch selectivity | Laura Faulk | 2008-11-25 |
| 6746616 | Method and apparatus for providing etch uniformity using zoned temperature control | H. Jim Fulford | 2004-06-08 |
| 6722942 | Chemical mechanical polishing with electrochemical control | Christopher H. Lansford, Bradley J. Yellitz | 2004-04-20 |
| 6689258 | Electrochemically generated reactants for chemical mechanical planarization | Christopher H. Lansford | 2004-02-10 |
| 6613594 | Surface plasmon resonance-based endpoint detection for chemical mechanical planarization (CMP) | Christopher H. Lansford | 2003-09-02 |
| 6567718 | Method and apparatus for monitoring consumable performance | William J. Campbell, Michael R. Conboy | 2003-05-20 |
| 6511898 | Method for controlling deposition parameters based on polysilicon grain size feedback | Thomas J. Sonderman, Anthony J. Toprac | 2003-01-28 |
| 6485990 | Feed-forward control of an etch processing tool | — | 2002-11-26 |
| 6461878 | Feedback control of strip time to reduce post strip critical dimension variation in a transistor gate electrode | — | 2002-10-08 |
| 6362116 | Method for controlling photoresist baking processes | — | 2002-03-26 |
| 6352870 | Method of endpointing plasma strip process by measuring wafer temperature | — | 2002-03-05 |
| 6350179 | Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer | William J. Campbell | 2002-02-26 |
| 6335286 | Feedback control of polish buff time as a function of scratch count | — | 2002-01-01 |
| 6291253 | Feedback control of deposition thickness based on polish planarization | Allen L. Evans | 2001-09-18 |
| 6285133 | Ion implanter with multi-level vacuum | Christopher H. Lansford | 2001-09-04 |
| 6276989 | Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishing | W. Jarrett Campbell, Christopher H. Raeder | 2001-08-21 |
| 6217412 | Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad | William J. Campbell | 2001-04-17 |
| 6213848 | Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer | William J. Campbell | 2001-04-10 |
| 6157078 | Reduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabrication | — | 2000-12-05 |