| 12431359 |
Semiconductor package electrical contacts and related methods |
Yusheng LIN, Francis J. Carney, Takashi Noma, Eiji KUROSE |
2025-09-30 |
| 12374554 |
Semiconductor packages with die including cavities and related methods |
Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE |
2025-07-29 |
| 12374555 |
Die sidewall coatings and related methods |
Francis J. Carney, Yusheng LIN, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE |
2025-07-29 |
| 12376333 |
Configurable low ohmic power circuits |
Santosh Menon, Radim SPETIK, Bruce Greenwood, Robert Davis, Ladislav Seliga |
2025-07-29 |
| 12354917 |
Singulation systems and related methods |
— |
2025-07-08 |
| 12341069 |
Backside metal patterning die singulation system and related methods |
— |
2025-06-24 |
| 12322632 |
Substrate alignment systems and related methods |
Takashi Noma |
2025-06-03 |
| 12315765 |
Backside metal patterning die singulation systems and related methods |
— |
2025-05-27 |
| 12272572 |
Non-planar semiconductor packaging systems and related methods |
Francis J. Carney |
2025-04-08 |
| 12266590 |
Dual side direct cooling semiconductor package |
Inpil Yoo, Jerome Teysseyre, Oseob Jeon, Keunhyuk LEE |
2025-04-01 |
| 12255167 |
Semiconductor packages with an intermetallic layer |
Francis J. Carney |
2025-03-18 |
| 12230551 |
Immersion direct cooling modules |
Oseob Jeon, Youngsun KO, Seungwon IM, Jerome Teysseyre |
2025-02-18 |
| 12230502 |
Semiconductor package stress balance structures and related methods |
Yusheng LIN, Francis J. Carney, Takashi Noma, Eiji KUROSE |
2025-02-18 |
| 12230559 |
Semiconductor device and method of forming micro interconnect structures |
Francis J. Carney, Jefferson W. Hall |
2025-02-18 |
| 12230543 |
Die cleaning systems and related methods |
— |
2025-02-18 |
| 12211784 |
SOI substrate and related methods |
Mark Griswold |
2025-01-28 |