Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1095474 | Power module package | Seungwon IM, Jeonghyuk Park, Keunhyuk LEE, Paolo BILARDO | 2025-09-30 |
| 12417999 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Seungwon IM, Jooyang EOM | 2025-09-16 |
| 12308364 | Power module package for direct cooling multiple power modules | Inpil Yoo, Jooyang EOM | 2025-05-20 |
| 12293955 | High power module package structures | Yusheng LIN | 2025-05-06 |
| 12266590 | Dual side direct cooling semiconductor package | Inpil Yoo, Oseob Jeon, Keunhyuk LEE, Michael J. Seddon | 2025-04-01 |
| 12230551 | Immersion direct cooling modules | Oseob Jeon, Youngsun KO, Seungwon IM, Michael J. Seddon | 2025-02-18 |
| 12205918 | Submodule semiconductor package | Jooyang EOM, Seungwon IM, Maria Cristina Estacio, Inpil Yoo | 2025-01-21 |