| D1095474 |
Power module package |
Jeonghyuk Park, Keunhyuk LEE, Jerome Teysseyre, Paolo BILARDO |
2025-09-30 |
| 12417999 |
Semiconductor packages using package in package systems and related methods |
Inpil Yoo, Maria Cristina Estacio, Jerome Teysseyre, Jooyang EOM |
2025-09-16 |
| 12368085 |
Integration of semiconductor device assemblies with thermal dissipation mechanisms |
Dongwook Kang, Oseob Jeon |
2025-07-22 |
| 12315826 |
Semiconductor device package assemblies with direct leadframe attachment |
Oseob Jeon |
2025-05-27 |
| 12300689 |
Dual cool power module with stress buffer layer |
Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE |
2025-05-13 |
| 12272615 |
Thermal mismatch reduction in semiconductor device modules |
Oseob Jeon |
2025-04-08 |
| 12230551 |
Immersion direct cooling modules |
Oseob Jeon, Youngsun KO, Jerome Teysseyre, Michael J. Seddon |
2025-02-18 |
| 12230601 |
High power module package structures |
Jooyang EOM, Inpil Yoo, Oseob Jeon |
2025-02-18 |
| 12230606 |
Semiconductor package and related methods |
Oseob Jeon, Joonseo SON, Mankyo Jong, Olaf Zschieschang |
2025-02-18 |
| 12211771 |
Power module and related methods |
Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE |
2025-01-28 |
| 12205918 |
Submodule semiconductor package |
Jooyang EOM, Maria Cristina Estacio, Jerome Teysseyre, Inpil Yoo |
2025-01-21 |