Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417999 | Semiconductor packages using package in package systems and related methods | Maria Cristina Estacio, Jerome Teysseyre, Seungwon IM, Jooyang EOM | 2025-09-16 |
| 12308364 | Power module package for direct cooling multiple power modules | Jerome Teysseyre, Jooyang EOM | 2025-05-20 |
| 12266590 | Dual side direct cooling semiconductor package | Jerome Teysseyre, Oseob Jeon, Keunhyuk LEE, Michael J. Seddon | 2025-04-01 |
| 12230601 | High power module package structures | Seungwon IM, Jooyang EOM, Oseob Jeon | 2025-02-18 |
| 12205918 | Submodule semiconductor package | Jooyang EOM, Seungwon IM, Maria Cristina Estacio, Jerome Teysseyre | 2025-01-21 |