Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1095474 | Power module package | Seungwon IM, Jeonghyuk Park, Jerome Teysseyre, Paolo BILARDO | 2025-09-30 |
| 12354930 | Module with substrate recess for conductive-bonding component | Leo GU, Sixin JI, Jie Chang, Yong Liu | 2025-07-08 |
| 12300689 | Dual cool power module with stress buffer layer | Jonghwan BAEK, Jeonghyuk Park, Seungwon IM | 2025-05-13 |
| 12266590 | Dual side direct cooling semiconductor package | Inpil Yoo, Jerome Teysseyre, Oseob Jeon, Michael J. Seddon | 2025-04-01 |
| 12211771 | Power module and related methods | Jonghwan BAEK, Jeonghyuk Park, Seungwon IM | 2025-01-28 |