Issued Patents 2025
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12429176 | Lighting apparatus | Hongkui Jiang | 2025-09-30 |
| 12431359 | Semiconductor package electrical contacts and related methods | Michael J. Seddon, Francis J. Carney, Takashi Noma, Eiji KUROSE | 2025-09-30 |
| 12414238 | Substrate structures and methods of manufacture | Sadamichi Takakusaki | 2025-09-09 |
| 12374555 | Die sidewall coatings and related methods | Francis J. Carney, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2025-07-29 |
| 12362266 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Stephen St. Germain | 2025-07-15 |
| 12355009 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Stephen St. Germain | 2025-07-08 |
| 12347755 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Stephen St. Germain | 2025-07-01 |
| 12347812 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Stephen St. Germain | 2025-07-01 |
| 12293955 | High power module package structures | Jerome Teysseyre | 2025-05-06 |
| 12261084 | Fan-out wafer level packaging of semiconductor devices | George Chang, Gordon M. Grivna, Takashi Noma | 2025-03-25 |
| 12230502 | Semiconductor package stress balance structures and related methods | Michael J. Seddon, Francis J. Carney, Takashi Noma, Eiji KUROSE | 2025-02-18 |
| 12211775 | Multiple substrate package systems and related methods | Atapol Prajuckamol, Chee Hiong CHEW | 2025-01-28 |
| 12199041 | Thinned semiconductor package and related methods | Takashi Noma, Francis J. Carney | 2025-01-14 |