Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261084 | Fan-out wafer level packaging of semiconductor devices | George Chang, Yusheng LIN, Takashi Noma | 2025-03-25 |
| 12224208 | Method of separating electronic devices having a back layer and apparatus | — | 2025-02-11 |