Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431359 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Michael J. Seddon, Francis J. Carney, Eiji KUROSE | 2025-09-30 |
| 12322632 | Substrate alignment systems and related methods | Michael J. Seddon | 2025-06-03 |
| 12261084 | Fan-out wafer level packaging of semiconductor devices | George Chang, Yusheng LIN, Gordon M. Grivna | 2025-03-25 |
| 12230502 | Semiconductor package stress balance structures and related methods | Yusheng LIN, Michael J. Seddon, Francis J. Carney, Eiji KUROSE | 2025-02-18 |
| 12199041 | Thinned semiconductor package and related methods | Yusheng LIN, Francis J. Carney | 2025-01-14 |