Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431359 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Michael J. Seddon, Francis J. Carney, Takashi Noma | 2025-09-30 |
| 12374554 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2025-07-29 |
| 12374555 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG | 2025-07-29 |
| 12341014 | Multi-faced molded semiconductor package and related methods | — | 2025-06-24 |
| 12230502 | Semiconductor package stress balance structures and related methods | Yusheng LIN, Michael J. Seddon, Francis J. Carney, Takashi Noma | 2025-02-18 |