Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431359 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Michael J. Seddon, Takashi Noma, Eiji KUROSE | 2025-09-30 |
| 12374554 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2025-07-29 |
| 12374555 | Die sidewall coatings and related methods | Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2025-07-29 |
| 12272572 | Non-planar semiconductor packaging systems and related methods | Michael J. Seddon | 2025-04-08 |
| 12255167 | Semiconductor packages with an intermetallic layer | Michael J. Seddon | 2025-03-18 |
| 12230502 | Semiconductor package stress balance structures and related methods | Yusheng LIN, Michael J. Seddon, Takashi Noma, Eiji KUROSE | 2025-02-18 |
| 12230559 | Semiconductor device and method of forming micro interconnect structures | Jefferson W. Hall, Michael J. Seddon | 2025-02-18 |
| 12199041 | Thinned semiconductor package and related methods | Yusheng LIN, Takashi Noma | 2025-01-14 |