Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424522 | Leadless semiconductor packages, leadframes therefor, and methods of making | Darrell D. Truhitte, Chee Hiong CHEW | 2025-09-23 |
| 12374554 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Eiji KUROSE | 2025-07-29 |
| 12374555 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Eiji KUROSE | 2025-07-29 |
| 12243810 | Semiconductor package with wettable flank and related methods | Hui Min LER, Chee Hiong CHEW | 2025-03-04 |