Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394692 | Power circuit module | Chee Hiong CHEW, Olaf Zschieschang | 2025-08-19 |
| 12362266 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2025-07-15 |
| 12355009 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2025-07-08 |
| 12347755 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2025-07-01 |
| 12347812 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2025-07-01 |
| 12308297 | Semiconductor package system and related methods | Yushuang YAO, Chee Hiong CHEW | 2025-05-20 |
| 12300558 | Substrates and related methods | Chee Hiong CHEW, Yushuang YAO, Vemmond Jeng Hung NG | 2025-05-13 |
| 12283562 | Clip design and method of controlling clip position | Chee Hiong CHEW, Vemmond Jeng Hung NG | 2025-04-22 |
| 12211775 | Multiple substrate package systems and related methods | Chee Hiong CHEW, Yusheng LIN | 2025-01-28 |