Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more | 2025-07-08 |
| 12354992 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Aleksandar Aleksov, Steve Cho, Leonel Arana, Robert Alan May +1 more | 2025-07-08 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Hongxia Feng, Steve Cho, Jung Kyu Han, Changhua Liu +4 more | 2025-06-24 |
| 12334422 | Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates | Kyle McElhinny, Onur Ozkan, Ali Lehaf, Steve Cho, Leonel Arana +4 more | 2025-06-17 |
| 12308329 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Rahul N. Manepalli | 2025-05-20 |
| 12255130 | Airgap structures for high speed signal integrity | Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Brandon C. Marin +4 more | 2025-03-18 |
| 12209711 | Flammable and explosive liquid transportation system and method and application thereof | Bo Li, Sichuan LIU, Wenjun Liu, Changbin WANG, Hongbo Tan +1 more | 2025-01-28 |