Issued Patents 2025
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218071 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2025-02-04 |
| 12218040 | Nested interposer with through-silicon via bridge die | Debendra Mallik, Kristof Darmawikarta, Ravindranath V. Mahajan, Rahul N. Manepalli | 2025-02-04 |
| 12199048 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Bharat P. Penmecha | 2025-01-14 |
| 12191240 | Hybrid glass core for wafer level and panel level packaging applications | Jieying Kong, Gang Duan | 2025-01-07 |