Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142551 | Package including multiple semiconductor devices | Maria Cristina Estacio, Seungwon IM | 2024-11-12 |
| 12087677 | Molded packaging for wide band gap semiconductor devices | Maria Clemens Y. Quinones, Bigildis Dosdos, Erwin Ian V. Almagro, Romel N. Manatad | 2024-09-10 |
| 12074160 | Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads | Tiburcio A. Maldo, Keunhyuk LEE | 2024-08-27 |
| 11988743 | Molded proximity sensor | Jing-En Luan | 2024-05-21 |
| 11984424 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Seungwon IM, Jooyang EOM | 2024-05-14 |
| 11935817 | Power device module with dummy pad die layout | Yusheng LIN, Huibin Chen | 2024-03-19 |
| 11908826 | Flexible clip with aligner structure | Keunhyuk LEE, Tiburcio A. Maldo | 2024-02-20 |