Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087677 | Molded packaging for wide band gap semiconductor devices | Maria Clemens Y. Quinones, Bigildis Dosdos, Jerome Teysseyre, Erwin Ian V. Almagro | 2024-09-10 |
| 12051635 | Semiconductor device package with clip interconnect and dual side cooling | Maria Cristina Estacio, Elsie Agdon Cabahug | 2024-07-30 |