Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142551 | Package including multiple semiconductor devices | Jerome Teysseyre, Seungwon IM | 2024-11-12 |
| 12051635 | Semiconductor device package with clip interconnect and dual side cooling | Elsie Agdon Cabahug, Romel N. Manatad | 2024-07-30 |
| 11984424 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Jerome Teysseyre, Seungwon IM, Jooyang EOM | 2024-05-14 |