Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142551 | Package including multiple semiconductor devices | Jerome Teysseyre, Maria Cristina Estacio | 2024-11-12 |
| 11984424 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Jerome Teysseyre, Jooyang EOM | 2024-05-14 |
| 11967540 | Integrated circuit direct cooling systems having substrates in contact with a cooling medium | Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2024-04-23 |
| 11961782 | Integration of semiconductor device assemblies with thermal dissipation mechanisms | Dongwook Kang, Oseob Jeon | 2024-04-16 |
| 11901309 | Semiconductor device package assemblies with direct leadframe attachment | Oseob Jeon | 2024-02-13 |