Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961782 | Integration of semiconductor device assemblies with thermal dissipation mechanisms | Seungwon IM, Oseob Jeon | 2024-04-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961782 | Integration of semiconductor device assemblies with thermal dissipation mechanisms | Seungwon IM, Oseob Jeon | 2024-04-16 |