Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984424 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Jerome Teysseyre, Seungwon IM | 2024-05-14 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984424 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Jerome Teysseyre, Seungwon IM | 2024-05-14 |