Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984424 | Semiconductor packages using package in package systems and related methods | Maria Cristina Estacio, Jerome Teysseyre, Seungwon IM, Jooyang EOM | 2024-05-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984424 | Semiconductor packages using package in package systems and related methods | Maria Cristina Estacio, Jerome Teysseyre, Seungwon IM, Jooyang EOM | 2024-05-14 |