Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087677 | Molded packaging for wide band gap semiconductor devices | Maria Clemens Y. Quinones, Bigildis Dosdos, Jerome Teysseyre, Romel N. Manatad | 2024-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087677 | Molded packaging for wide band gap semiconductor devices | Maria Clemens Y. Quinones, Bigildis Dosdos, Jerome Teysseyre, Romel N. Manatad | 2024-09-10 |