Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183646 | Semiconductor device with a dielectric between portions | — | 2024-12-31 |
| 12176220 | Optical sensor package and method of making an optical sensor package | — | 2024-12-24 |
| 12002898 | Embedded wafer level optical sensor packaging | — | 2024-06-04 |
| 11988743 | Molded proximity sensor | Jerome Teysseyre | 2024-05-21 |