Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119576 | Press-fit power module and related methods | Jie Chang, Huibin Chen, Keunhyuk LEE | 2024-10-15 |
| 12074160 | Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads | Keunhyuk LEE, Jerome Teysseyre | 2024-08-27 |
| 11908826 | Flexible clip with aligner structure | Keunhyuk LEE, Jerome Teysseyre | 2024-02-20 |