Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183785 | Monolithic semiconductor device assemblies | Peter Moens, Gordon M. Grivna | 2024-12-31 |
| 12062549 | Semiconductor packages and related methods | Yong Liu, Liangbiao CHEN | 2024-08-13 |
| 12040192 | Die sidewall coatings and related methods | Francis J. Carney, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-07-16 |
| 12040295 | Semiconductor device with backmetal and related methods | Michael J. Seddon, Takashi Noma, Kazuo Okada, Hideaki Yoshimi, Naoyuki Yomoda | 2024-07-16 |
| 11955412 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Stephen St. Germain | 2024-04-09 |
| 11948870 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Stephen St. Germain | 2024-04-02 |
| 11935817 | Power device module with dummy pad die layout | Jerome Teysseyre, Huibin Chen | 2024-03-19 |
| 11908840 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Stephen St. Germain | 2024-02-20 |
| 11894347 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Stephen St. Germain | 2024-02-06 |