| 12154783 |
Semiconductor wafer and method of wafer thinning |
— |
2024-11-26 |
| 12154877 |
Semiconductor wafer and method of ball drop on thin wafer with edge support ring |
Takashi Noma, Kazuhiro Saito |
2024-11-26 |
| 12148665 |
Jet ablation die singulation systems and related methods |
— |
2024-11-19 |
| 12132008 |
Multidie supports and related methods |
Francis J. Carney |
2024-10-29 |
| 12132005 |
Supports for thinned semiconductor substrates and related methods |
Francis J. Carney |
2024-10-29 |
| 12119294 |
Through-substrate via structure and method of manufacture |
Francis J. Carney |
2024-10-15 |
| 12094750 |
Tape heating methods |
— |
2024-09-17 |
| 12040192 |
Die sidewall coatings and related methods |
Francis J. Carney, Yusheng LIN, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE |
2024-07-16 |
| 12040295 |
Semiconductor device with backmetal and related methods |
Takashi Noma, Kazuo Okada, Hideaki Yoshimi, Naoyuki Yomoda, Yusheng LIN |
2024-07-16 |
| 12020972 |
Curved semiconductor die systems and related methods |
Francis J. Carney |
2024-06-25 |
| 11987874 |
Backside metal formation methods and systems |
— |
2024-05-21 |
| 11972980 |
Singulation systems and related methods |
— |
2024-04-30 |
| 11948880 |
SOI substrate and related methods |
Mark Griswold |
2024-04-02 |
| 11942366 |
Backside metal patterning die singulation systems and related methods |
— |
2024-03-26 |
| 11929285 |
Backside metal patterning die singulation system and related methods |
— |
2024-03-12 |
| 11908699 |
Semiconductor packages with die including cavities |
Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE |
2024-02-20 |
| 11901184 |
Backmetal removal methods |
Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE |
2024-02-13 |
| 11894245 |
Non-planar semiconductor packaging systems and related methods |
Francis J. Carney |
2024-02-06 |