| 12176272 |
Semiconductor package with wettable flank |
Hui Min LER, Soon Wei WANG |
2024-12-24 |
| 12040192 |
Die sidewall coatings and related methods |
Francis J. Carney, Yusheng LIN, Michael J. Seddon, Soon Wei WANG, Eiji KUROSE |
2024-07-16 |
| 12033904 |
Semiconductor package system and related methods |
Yushuang YAO, Atapol Prajuckamol |
2024-07-09 |
| 11955412 |
Low stress asymmetric dual side module |
Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN |
2024-04-09 |
| 11948870 |
Low stress asymmetric dual side module |
Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN |
2024-04-02 |
| 11908840 |
Low stress asymmetric dual side module |
Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN |
2024-02-20 |
| 11908699 |
Semiconductor packages with die including cavities |
Michael J. Seddon, Francis J. Carney, Soon Wei WANG, Eiji KUROSE |
2024-02-20 |
| 11901184 |
Backmetal removal methods |
Michael J. Seddon, Francis J. Carney, Soon Wei WANG, Eiji KUROSE |
2024-02-13 |
| 11894234 |
Semiconductor packages with die support structure for thin die |
Francis J. Carney, Soon Wei WANG, Eiji KUROSE |
2024-02-06 |
| 11894347 |
Low stress asymmetric dual side module |
Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN |
2024-02-06 |