Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131981 | Power module package baseplate with step recess design | Vemmond Jeng Hung NG | 2024-10-29 |
| 12033904 | Semiconductor package system and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2024-07-09 |
| 11894292 | Power module | Qing Yang, Yong Liu | 2024-02-06 |