Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033904 | Semiconductor package system and related methods | Yushuang YAO, Chee Hiong CHEW | 2024-07-09 |
| 11955412 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2024-04-09 |
| 11948870 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2024-04-02 |
| 11908840 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2024-02-20 |
| 11894347 | Low stress asymmetric dual side module | Chee Hiong CHEW, Stephen St. Germain, Yusheng LIN | 2024-02-06 |