Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984388 | Semiconductor package structures and methods of manufacture | Jay A. Yoder, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya | 2024-05-14 |
| 11955412 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2024-04-09 |
| 11948870 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2024-04-02 |
| 11908840 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2024-02-20 |
| 11894347 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Yusheng LIN | 2024-02-06 |
| 11881398 | Semiconductor device and method for supporting ultra-thin semiconductor die | Gordon M. Grivna | 2024-01-23 |