Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040192 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG | 2024-07-16 |
| 12040310 | Methods of forming semiconductor packages with back side metal | — | 2024-07-16 |
| 11908699 | Semiconductor packages with die including cavities | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2024-02-20 |
| 11901184 | Backmetal removal methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2024-02-13 |
| 11894234 | Semiconductor packages with die support structure for thin die | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2024-02-06 |