Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170239 | Direct bonded copper substrates fabricated using silver sintering | Erik Nino Tolentino, Shutesh Krishnan | 2024-12-17 |
| 12132008 | Multidie supports and related methods | Michael J. Seddon | 2024-10-29 |
| 12132005 | Supports for thinned semiconductor substrates and related methods | Michael J. Seddon | 2024-10-29 |
| 12119294 | Through-substrate via structure and method of manufacture | Michael J. Seddon | 2024-10-15 |
| 12040192 | Die sidewall coatings and related methods | Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-07-16 |
| 12020972 | Curved semiconductor die systems and related methods | Michael J. Seddon | 2024-06-25 |
| 11908699 | Semiconductor packages with die including cavities | Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-02-20 |
| 11901184 | Backmetal removal methods | Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-02-13 |
| 11894234 | Semiconductor packages with die support structure for thin die | Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-02-06 |
| 11894245 | Non-planar semiconductor packaging systems and related methods | Michael J. Seddon | 2024-02-06 |