Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170239 | Direct bonded copper substrates fabricated using silver sintering | Erik Nino Tolentino, Francis J. Carney | 2024-12-17 |
| 12160060 | Bonding module pins to an electronic substrate | Erik Nino Tolentino, Dennis Cadiz YBORDE, Pui Leng LOW | 2024-12-03 |
| 11942369 | Thin semiconductor package for notched semiconductor die | Sw Wang, CH CHEW, How Kiat Liew, Fui Fui Tan | 2024-03-26 |