Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170239 | Direct bonded copper substrates fabricated using silver sintering | Shutesh Krishnan, Francis J. Carney | 2024-12-17 |
| 12160060 | Bonding module pins to an electronic substrate | Dennis Cadiz YBORDE, Shutesh Krishnan, Pui Leng LOW | 2024-12-03 |